Title :
Hermeticity Testing and Failure Analysis of MEMS Packages
Author :
De Wolf ; Jourdain, Anne ; De Moor, P. ; Tilmans, Harrie A. C. ; Marchand, Laurent
Author_Institution :
IMEC, Leuven
Abstract :
Several microsystem applications require hermetic or semi- hermetic packages. It is for this reason mandatory to be able to check the hermeticity of these packages. The standard tests, using gross leak and fine leak, work very well for large cavities, but might give erroneous results for small cavities as typically used for MEMS. We discussed different alternative test methods.
Keywords :
failure analysis; micromechanical devices; packaging; MEMS packages; failure analysis; hermeticity testing; large cavities; microsystem; semihermetic packages; Detectors; Failure analysis; Leak detection; Micromechanical devices; Packaging; Temperature;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378075
