Title :
Temporary bonding/debonding based on propylene carbonate
Author :
Zhu, Zhiyuan ; Du, Hong ; Guan, Yong ; Wang, Hao ; Yu, Min ; Jin, Yufeng ; Zhang, Zhao
Author_Institution :
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, China
Abstract :
This paper carried out extensive research about temporary bonding/debonding schemes based on propylene carbonate (PPC). The temporary bonding was investigated at different bonding temperatures and bonding time. The bonding pressure is 0.2 MPa. The highest shear strength of 4.1 MPa is achieved at bonding temperature of 150°C and bonding time of 20 min. The bonded wafers were debonded using thermal and chemical method.
Keywords :
Bonding; ISO Standards; Packaging; Polymers; Silicon; PPC; bonding; debonding; temporary;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236565
