DocumentCode
2017778
Title
Reliability of Pb-free solder joints in FCBGA using finite element simulation and Taguchi method
Author
Zhang, Liang ; Sun, Lei ; Zhong, Su-juan ; Ma, Jia ; Bao, Li
Author_Institution
School of Mechanical & Electrical Engineering, Jiangsu Normal University, Xuzhou, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
197
Lastpage
200
Abstract
Thermo-mechanical reliability of containing Pb and Pb-free solder joints in FCBGA device subjected to an accelerated thermal cyclic loading was investigated based on finite element simulation and Taguchi method. Effects of different control factors on the reliability of the lead-free solder joints were anlyzed and calculated. The corner solder joint is the most critical solder joints in the ball array, the top surface of the solder joint is the crack propagated location. The optimal combination in FCBGA assembly show obvious enhancement effect on fatigue life of solder joints. Moreover, the solder material is the most important factor among the control factors in the FCBGA device.
Keywords
Creep; Finite element analysis; Lead; Reliability; Soldering; Strain; Temperature distribution; Taguchi method; fatigue life; finite element simulation; solder joints;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236574
Filename
7236574
Link To Document