Title :
Soft Defects: Challenge and Chance for Failure Analysis
Author :
Burmer, C. ; Brillert, C. ; Zhongling Qian
Author_Institution :
Infineon AG, Munich
Abstract :
Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called ´soft defects´. In this paper, an analysis flow especially for parameter dependent scan fails is presented. For the two major localization techniques, namely soft defect localization (SDL) and internal signal measurement enhanced activation and localization procedures using test systems are proposed.
Keywords :
failure analysis; integrated circuit reliability; integrated logic circuits; mixed analogue-digital integrated circuits; failure analysis; internal signal measurement; parameter dependent scan; soft defect localization techniques; test systems; Failure analysis; Fault diagnosis; Logic devices; Logic testing; Performance evaluation; Software tools; System testing; Test pattern generators; Timing; Voltage;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378091
