DocumentCode
2017854
Title
Soft Defects: Challenge and Chance for Failure Analysis
Author
Burmer, C. ; Brillert, C. ; Zhongling Qian
Author_Institution
Infineon AG, Munich
fYear
2007
fDate
11-13 July 2007
Abstract
Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called ´soft defects´. In this paper, an analysis flow especially for parameter dependent scan fails is presented. For the two major localization techniques, namely soft defect localization (SDL) and internal signal measurement enhanced activation and localization procedures using test systems are proposed.
Keywords
failure analysis; integrated circuit reliability; integrated logic circuits; mixed analogue-digital integrated circuits; failure analysis; internal signal measurement; parameter dependent scan; soft defect localization techniques; test systems; Failure analysis; Fault diagnosis; Logic devices; Logic testing; Performance evaluation; Software tools; System testing; Test pattern generators; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location
Bangalore
Print_ISBN
978-1-4244-1014-9
Type
conf
DOI
10.1109/IPFA.2007.4378091
Filename
4378091
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