• DocumentCode
    2017895
  • Title

    A model to hardware comparison of simultaneous switching noise on a CMOS chip

  • Author

    McCredie, B. ; Kuppinger, S. ; Katopis, G. ; Becker, W.D.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    43
  • Lastpage
    45
  • Abstract
    The simultaneous switching noise simulation and the comparison of those simulations to laboratory measurements of noise on a specially designed CMOS test chip on a multilayer ceramic SCM are presented
  • Keywords
    integrated circuit noise; CMOS chip; multilayer ceramic SCM; noise simulation; simultaneous switching noise; Circuit noise; Circuit simulation; Hardware; Laboratories; Noise measurement; Packaging; Power distribution; Power supplies; Semiconductor device measurement; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594066
  • Filename
    594066