Title :
A model to hardware comparison of simultaneous switching noise on a CMOS chip
Author :
McCredie, B. ; Kuppinger, S. ; Katopis, G. ; Becker, W.D.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
The simultaneous switching noise simulation and the comparison of those simulations to laboratory measurements of noise on a specially designed CMOS test chip on a multilayer ceramic SCM are presented
Keywords :
integrated circuit noise; CMOS chip; multilayer ceramic SCM; noise simulation; simultaneous switching noise; Circuit noise; Circuit simulation; Hardware; Laboratories; Noise measurement; Packaging; Power distribution; Power supplies; Semiconductor device measurement; Semiconductor device modeling;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594066
