Title :
Electroless plating alloy thin-film embedded resistor materials
Author :
Su, Xingsong ; Lai, Lifei ; Li, Chang ; Liu, Wenjun ; Fu, Xian-Zhu ; Sun, Rong ; Wong, C.P.
Author_Institution :
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China
Abstract :
Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films´ sheet resistance, corrosion resistance and hardness increase with the increase of P content.
Keywords :
Assembly; Impedance; Metals; Packaging; Resistance; Ni alloy; corrosion resistance; electroless plating; thin film embedded resistor;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236584
