Failure Analysis of I/O with ESD Protection Devices in Advanced CMOS Technologies

Author

Muhammad, Muhammad ; Gauthier, R. ; Chatty, K. ; Junjun Li ; Seguin, Chris

Author_Institution

IBM Semicond. Res., Essex Junction

fYear

2007

fDate

11-13 July 2007

Abstract

Many types of ESD protection devices such as diodes, NFETs, SCRs and RC-triggered power clamps having different failure mechanisms are used in advanced CMOS technologies. Circuit schematic analysis and SEM failure analysis are utilized to clearly predict and identify the failing I/O driver/receiver devices and/or the various ESD protection devices during an ESD event.

Keywords

CMOS integrated circuits; electrostatic discharge; failure analysis; integrated circuit reliability; CMOS technologies; ESD protection devices; SEM; circuit schematic analysis; electrostatic discharge; failure analysis; CMOS technology; Circuit analysis; Clamps; Driver circuits; Electrostatic discharge; Failure analysis; Protection; Research and development; Semiconductor diodes; Thyristors;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the

Conference_Location

Bangalore

Print_ISBN

978-1-4244-1014-9

Type

conf

DOI

10.1109/IPFA.2007.4378100

Filename

4378100

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2018142