• DocumentCode
    2018270
  • Title

    Chip-to-chip optical interconnects

  • Author

    Kash, J.A. ; Doany, F.E. ; Schares, L. ; Schow, C.L. ; Schuster, C. ; Kuchta, D.M. ; Pepeljugoski, P.K. ; Trewhella, J.M. ; Baks, C.W. ; John, R.A. ; Shan, L. ; Kwark, Y.H. ; Budd, R.A. ; Chiniwalla, P. ; Libsch, F.R. ; Rosner, J. ; Tsang, C.K. ; Patel, C

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY
  • fYear
    2006
  • fDate
    5-10 March 2006
  • Abstract
    Terabus is based on a silicon-carrier interposer on an organic card containing 48 polymer waveguides. We have demonstrated 4times12 arrays of low power optical transmitters and receivers, operating up to 20 Gb/s and 14 Gb/s per channel respectively
  • Keywords
    integrated optics; integrated optoelectronics; optical arrays; optical fibre communication; optical interconnections; optical polymers; optical receivers; optical transmitters; optical waveguides; silicon; 14 Gbit/s; 20 Gbit/s; Si; Terabus; chip-to-chip interconnects; optical interconnects; optical receivers; optical transmitters; organic card; polymer waveguides; silicon-carrier interposer; Assembly; Bonding; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Silicon; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference, 2006 and the 2006 National Fiber Optic Engineers Conference. OFC 2006
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    1-55752-803-9
  • Type

    conf

  • DOI
    10.1109/OFC.2006.215933
  • Filename
    1636964