Title :
Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device
Author :
Thakur, S.K. ; Gan Tai Kwee
Author_Institution :
Delphi Automotive Syst., Singapore
Abstract :
The damaged wire on the wedge resulted in physically thinning of the wire and caused low pull of second bond between gold wire and gold substrate of MEMS component. The thinned wire due to lower cross-section was unable to take high pull force and hence showed poor load sharing with the substrate and hence failed with low pull strength.
Keywords :
failure analysis; lead bonding; micromechanical devices; MEMS component; failure analysis; gold substrate; gold wire; low pull strength; thermosonic wedge bond; Diffusion bonding; Failure analysis; Microelectromechanical devices; Micromechanical devices; Microstructure; Scanning electron microscopy; Soldering; Substrates;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378106
