Title :
The role of component packaging in system electromagnetic compatibility
Author_Institution :
Missouri Univ., Rolla, MO, USA
Abstract :
Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner
Keywords :
packaging; EMC design models; component packaging; electromagnetic compatibility; electronic systems; Circuits; Clocks; Electromagnetic compatibility; Electromagnetic modeling; Electronics packaging; Frequency; Guidelines; Signal design; Space technology; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594068
