Title :
Thin film inverted MSM photodetector with top bonding pads for nano paste metallization
Author :
Kondo, Taka-Yuki ; Onishi, Hajime ; Nomura, Hiroshi ; Kaneko, Tetsuya ; Shimoda, Tatsuya
Author_Institution :
Seiko Epson Corp., Nagano, Japan
Abstract :
This study has demonstrated the assembly of a thin film inverted MSM photodetector (I-MSM) on a Si CMOS TIA in a monolithic dimension. The I-MSM has top bonding pads and is connected with the TIA using nano paste metallization. Operation at 622 M-bit/s with optical input has been successfully demonstrated.
Keywords :
CMOS integrated circuits; assembling; integrated optoelectronics; metal-semiconductor-metal structures; metallisation; photodetectors; thin film devices; 622 Mbit/s; Si; Si CMOS; assembly; inverted MSM photodetector; monolithic dimension; nanopaste metallization; optoelectronics integrated circuit fabrication; thin film photodetector; top bonding pads; transimpedance amplifier; Assembly; Atherosclerosis; Electrodes; Gallium arsenide; Metallization; Optoelectronic devices; Photodetectors; Polyimides; Transistors; Wafer bonding;
Conference_Titel :
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN :
0-7803-8557-8
DOI :
10.1109/LEOS.2004.1363313
