• DocumentCode
    2018831
  • Title

    Facile synthesis of silver nanoparticles decorated boron nitride nanosheets hybrids

  • Author

    Wang Fangfang ; Zeng Xiaoliang ; Yao Yimin ; Sun Rong ; Xu Jianbin

  • Author_Institution
    Shenzhen Electron. Packaging Mater. Eng. Lab., Shenzhen Inst. of Adv. Technol., Shenzhen, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    381
  • Lastpage
    386
  • Abstract
    A simple method for decoration of silver nanoparticles (AgNPs) on boron nitride nanosheets (BNNSs) has been designed based on liquid-phase exfoliation and surface chemical reduction in organic solvent. In the present work, N, N-dimethylformamide was employed as both the exfoliation solvent of BNNSs and the reducing agent of Ag+ ions. Polyvinylpyrrolidone (PVP) was introduced to stabilize the AgNPs and control their sizes. No other additives were present in the system. The structure and morphology of the nanocomposites (BNNSs/AgNPs) were comfirmed by means of scanning electron microscope (SEM), transmission electron microscopy (TEM), atomic force microscopy (AFM). The results demonstrated AgNPs with a small particle size (10-20 nm) and good distribution on the surface of BNNSs. This method will facilitate the preparation of BNNS-based materials for various applications.
  • Keywords
    III-V semiconductors; atomic force microscopy; boron compounds; nanocomposites; nanofabrication; nanoparticles; reduction (chemical); scanning electron microscopy; silver; surface chemistry; transmission electron microscopy; wide band gap semiconductors; Ag-BN; N, N-dimethylformamide; PVP; atomic force microscopy; liquid-phase exfoliation; morphology; nanocomposites; organic solvent; polyvinylpyrrolidone; scanning electron microscopy; silver nanoparticles decorated boron nitride nanosheets hybrids; surface chemical reduction; transmission electron microscopy; Absorption; Boron; Chemicals; Dispersion; Nanoparticles; Silver; Surface morphology; boron nitride nanosheets; decoration; silver nanoparticles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236611
  • Filename
    7236611