Evaluation of a new measurement set-up for the accurate characterization of the near-field radiated emission of printed circuit boards

In this paper, the near-field radiated emission from printed circuit boards is studied by means of a new in-house developed three-dimensional measurement set-up, yielding a high degree of accuracy and flexibility. The performance of the set-up is evaluated by analyzing a single microstrip line. A good correspondence between simulated and measured results is obtained. Moreover, the flexibility of the proposed set-up is demonstrated by means of a two-dimensional near-field scan over a more complex printed circuit trace