Title :
Effects of packaging design on the performance of TWEAM module for digital and analog applications
Author :
Choi, Kwang-Seong ; Lee, John-Hyun ; Lim, Jiyoun ; Kang, Young-Shik ; Chung, Yong-Duck ; Moon, Jong-Tae ; Kim, Jeha
Author_Institution :
Basic Res. Lab., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
With optimized packaging design, 40 Gbps broadband TWEAM module and 40 GHz band TWEAM module were developed. The packaging technology included resonance suppression in broadband and impedance matching at 40 GHz in narrowband.
Keywords :
electro-optical modulation; electroabsorption; electrodes; integrated optoelectronics; modules; packaging; 40 GHz; 40 Gbit/s; RFf transmission systems; TWEAM module; WDM; analog applications; broadband matching; broadband module; digital applications; electroabsorption modulator; impedance matching; narrowband module; packaging design; resonance suppression; travelling wave electrode; Coplanar waveguides; Digital modulation; Electrodes; Electronics packaging; Frequency response; Impedance matching; Optical modulation; Radio frequency; Resonance; Wavelength division multiplexing;
Conference_Titel :
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN :
0-7803-8557-8
DOI :
10.1109/LEOS.2004.1363339
