Title :
A compact high power T/R module for X-band phased array radar applications using an anodized aluminum substrate
Author :
Yeo, Sung-Ku ; Kim, Cheol Ho ; Ahn, Jeong-Ho ; Chun, Jong-Hoon ; Kwon, Young-Se
Author_Institution :
Dept. EECS, KAIST, Daejeon, South Korea
fDate :
Sept. 29 2009-Oct. 1 2009
Abstract :
This paper presents a compact high-power X-band transmit/receive (T/R) module based on a multi-chip-module (MCM) structure using a selectively anodized aluminum substrate. The proposed T/R module package used thick anodized aluminum (Al2O3) layers and bare MMICs directly mounted on an aluminum substrate for an effective heat sink and a high electrical isolation. The study demonstrates a 28 × 28 × 0.5 mm3 compact T/R module for X-band phased array applications. The fabricated T/R module has a maximum transmit output power of 39.21 dBm (8.3 W), maximum transmit gain of 39.82 dB, and receive gain of 22.1 dB over the 9-10 GHz frequency band. The RF-signal phase amplitude control is achieved with a six-bit phase shifter with RMS accuracy better than 6° and a gain setting range of 24 dB with RMS accuracy better than 2 dB. The proposed aluminum package has the advantages of reducing the module size, decreasing the cost, and managing thermal problems in X-band high-power T/R module package applications.
Keywords :
MMIC; aluminium; anodised layers; heat sinks; multichip modules; phase shifters; phased array radar; Al; Al2O3; MCM; MMIC; X-band phased array radar application; anodized aluminum substrate; frequency 9 GHz to 10 GHz; heat sink; high electrical isolation; high-power receive module; high-power transmit module; maximum transmit gain; maximum transmit output power; monolithic microwave integrated circuit; multichip module structure; radiofrequency signal phase amplitude control; six-bit phase shifter; thermal problem; Aluminum; Gain; Heat sinks; MMICs; Packaging; Phased arrays; Power generation; Radar applications; Resistance heating; Thermal management;
Conference_Titel :
Microwave Conference, 2009. EuMC 2009. European
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4748-0