• DocumentCode
    2019925
  • Title

    The hybrid method is introduced to use in suppression to synchronous switch noise in high-speed

  • Author

    Liuping, Wang ; Dong Kai, ShangGuan ; Liqiang, Cao ; Yuan, Lu

  • Author_Institution
    Institute of Microelectronics Chinese Academy of Sciences Beijing, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    561
  • Lastpage
    563
  • Abstract
    In this paper, a novel plane of electromagnetic bandgap (EBG) structure for wideband mitigation of simultaneous switching noise (SSN) based on the modern packaging materials and embedded technology. From the simulated and measured results of the proposed EBG structure, a wideband suppression of SSN ranges from 0.1 GHz to 20GHz is achieved with a high mitigation level of −40 dB. Furthermore, the influence of the proposed power plane of EBG structure on the signal integrity (SI) is investigated in the time and frequency domains, respectively. The results show that the SI performance can be improved significantly by using differential pairs for the signals.
  • Keywords
    Crystals; Metamaterials; Packaging; Periodic structures; Resonant frequency; Scattering; Sensitivity; differential pair; electromagnetic bandgap structure (EBG); embedded technology; power integrity (PI); signal integrity (SI);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236649
  • Filename
    7236649