DocumentCode :
2019925
Title :
The hybrid method is introduced to use in suppression to synchronous switch noise in high-speed
Author :
Liuping, Wang ; Dong Kai, ShangGuan ; Liqiang, Cao ; Yuan, Lu
Author_Institution :
Institute of Microelectronics Chinese Academy of Sciences Beijing, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
561
Lastpage :
563
Abstract :
In this paper, a novel plane of electromagnetic bandgap (EBG) structure for wideband mitigation of simultaneous switching noise (SSN) based on the modern packaging materials and embedded technology. From the simulated and measured results of the proposed EBG structure, a wideband suppression of SSN ranges from 0.1 GHz to 20GHz is achieved with a high mitigation level of −40 dB. Furthermore, the influence of the proposed power plane of EBG structure on the signal integrity (SI) is investigated in the time and frequency domains, respectively. The results show that the SI performance can be improved significantly by using differential pairs for the signals.
Keywords :
Crystals; Metamaterials; Packaging; Periodic structures; Resonant frequency; Scattering; Sensitivity; differential pair; electromagnetic bandgap structure (EBG); embedded technology; power integrity (PI); signal integrity (SI);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
Type :
conf
DOI :
10.1109/ICEPT.2015.7236649
Filename :
7236649
Link To Document :
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