DocumentCode
2019925
Title
The hybrid method is introduced to use in suppression to synchronous switch noise in high-speed
Author
Liuping, Wang ; Dong Kai, ShangGuan ; Liqiang, Cao ; Yuan, Lu
Author_Institution
Institute of Microelectronics Chinese Academy of Sciences Beijing, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
561
Lastpage
563
Abstract
In this paper, a novel plane of electromagnetic bandgap (EBG) structure for wideband mitigation of simultaneous switching noise (SSN) based on the modern packaging materials and embedded technology. From the simulated and measured results of the proposed EBG structure, a wideband suppression of SSN ranges from 0.1 GHz to 20GHz is achieved with a high mitigation level of −40 dB. Furthermore, the influence of the proposed power plane of EBG structure on the signal integrity (SI) is investigated in the time and frequency domains, respectively. The results show that the SI performance can be improved significantly by using differential pairs for the signals.
Keywords
Crystals; Metamaterials; Packaging; Periodic structures; Resonant frequency; Scattering; Sensitivity; differential pair; electromagnetic bandgap structure (EBG); embedded technology; power integrity (PI); signal integrity (SI);
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236649
Filename
7236649
Link To Document