The effect of flux components on the slump-in-heating resistance of Sn-3.0Ag-0.5Cu solder paste

Solder pastes are widely used as a principal bonding medium in the electronics industry. Many paste parameters, such as paste composition, printing stencil aperture and reflowing profile, influence the printing performance and the reflow process of solder pastes. In this paper, experiments are conducted to investigate the effect of filmogens and solvents on slump-in-heating resistance of Sn-3Ag-0.5Cu solder paste. The results show that with higher softening point of filmogens or higher volatility of solvents at high temperature, the viscosity of solder paste at high temperature is higher, which contributes to better slump-in-heating resistance of Sn-3.0Ag-0.5Cu solder paste.