Title :
Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections
Author :
Bakir, Muhannad S. ; Meindl, James D.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.
Keywords :
integrated optoelectronics; optical interconnections; packaging; I/O interconnections; SoL processing; electrical characteristics; electrical interconnections; mechanical characteristics; optical characteristics; optical interconnections; optoelectronic chips; optoelectronic devices; process integration; sea of leads; wafer-level packaging; Assembly; Bandwidth; Mirrors; Optical coupling; Optical devices; Optical films; Optical interconnections; Optical polymers; Packaging; Wafer scale integration;
Conference_Titel :
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN :
0-7803-8557-8
DOI :
10.1109/LEOS.2004.1363373
