• DocumentCode
    2020269
  • Title

    Optimization of Warpage Defect in Injection Moulding Process Using ABS Material

  • Author

    Ahmad, A.H. ; Leman, Z. ; Azmir, M.A. ; Muhamad, K.F. ; Harun, W.S.W. ; Juliawati, A. ; Alias, A.B.S.

  • Author_Institution
    Fac. of Mech. Eng., Univ. Malaysia Pahang, Kuantan
  • fYear
    2009
  • fDate
    25-29 May 2009
  • Firstpage
    470
  • Lastpage
    474
  • Abstract
    Plastic injection moulding process produces various defects such as warpage, sink marks, weld lines and shrinkage. The purpose of present paper is to analyze the warpage defect on Acrylonitrile Butadiene Styrene (ABS) for selected part using FEA simulation. The approach was based on Taguchipsilas Method and Analysis of Variance (ANOVA) to optimize the processing parameters namely packing pressure, mould temperature, melt temperature and packing time for effective process. It was found that the optimum parameters for ABS material are packing pressure at 375 MPa, mould temperature at 40degC, melt temperature at 200degC and packing time at 1 s. Melt temperature was found to be the most significant factor followed by packing time and mould temperature. Meanwhile, packing pressure was insignificant factor contributing to the warpage in present study.
  • Keywords
    Taguchi methods; injection moulding; plastic packaging; shrinkage; ABS material; Taguchi method; acrylonitrile butadiene styrene; analysis of variance; plastic injection moulding process; pressure 375 MPa; shrinkage; sink marks; temperature 200 degC; temperature 40 degC; time 1 s; warpage defect; weld lines; Analysis of variance; Asia; Computational modeling; Injection molding; Internal stresses; Material properties; Plastics; Raw materials; Temperature; Welding; ANOVA; FEA simulation; Injection moulding; Taguchi´s Method; warpage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modelling & Simulation, 2009. AMS '09. Third Asia International Conference on
  • Conference_Location
    Bali
  • Print_ISBN
    978-1-4244-4154-9
  • Electronic_ISBN
    978-0-7695-3648-4
  • Type

    conf

  • DOI
    10.1109/AMS.2009.120
  • Filename
    5072032