DocumentCode
2020272
Title
Development of TSV-based inductors in power electronics packaging
Author
Mondal, Saikat ; Gamboa, Jonathan ; Kim, Bruce
Author_Institution
Department of Electrical Engineering, City University of New York, USA
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
622
Lastpage
626
Abstract
This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.
Keywords
Filtering theory; Inductors; Magnetic separation; Packaging; Through-silicon vias; Toroidal magnetic fields; Power electronics; TSV; ferromagnetic material; inductor; nickel;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236663
Filename
7236663
Link To Document