DocumentCode :
2020339
Title :
Limitations of electromagnetic-based package analysis tools
Author :
Rubin, Barry J.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1994
fDate :
2-4 Nov 1994
Firstpage :
65
Lastpage :
68
Abstract :
Through the use of specially designed problems that stress package analysis codes, the author provides valuable insight and shows users how to determine if their codes are providing the correct solutions to their packaging problems
Keywords :
packaging; EMI; conducting cube; contact resistance structure; current loop; dipole; electromagnetic-based package analysis tools; electronic packaging; inductive loop; leakage field; mesh planes; moment based codes; numerical grid; Automatic testing; Electromagnetic analysis; Electronics packaging; Frequency; Inductance; Permeability; Scattering; Sensitivity analysis; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
Type :
conf
DOI :
10.1109/EPEP.1994.594076
Filename :
594076
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2020339
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