Title :
A failure analysis on leakage of ceramic capacitor
Author :
Cui, Junchao ; Wu, Junming
Author_Institution :
Reliability Research and Analysis Center, CEPREI, Guangzhou, China
Abstract :
Failure analysis is a comprehensive process which needs to apply kinds of physical and chemistry methods to find out the mechanism. You must learn as more background information as you can, only then could you choose the applicable methods to study the failure sample avoiding disturbance aroused by analysis methods. In this paper, a print circuit board assembly of TV sets which were exported to South America will be analyzed.
Keywords :
Capacitors; Conductivity measurement; Mechanical variables measurement; Resistance; Resistance heating; Surface contamination; SEM&EDS; ceramic capacitor; cross section; leakage; tumor; void;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236671
