• DocumentCode
    2020525
  • Title

    Modeling of integrated microstrip lines on silicon substrates up to 140 GHz

  • Author

    Gruner, Daniel ; Zhang, Zihui ; Boeck, Georg

  • Author_Institution
    Microwave Eng. Lab., Berlin Inst. of Technol., Berlin, Germany
  • fYear
    2009
  • fDate
    Sept. 29 2009-Oct. 1 2009
  • Firstpage
    894
  • Lastpage
    897
  • Abstract
    This work presents a successive modeling approach for microstrip lines on silicon substrates targeted for integrated millimeter wave circuits. The characteristic impedance and the complex propagation coefficient are extracted from 3D electromagnetic simulations for strip widths in the range of W=2.4-50 um up to 140 GHz. The derivation of the frequency dependence and strip width dependence of these quantities is carried out using curve fitting algorithms. The integration of the determined functions in circuit simulation environments is demonstrated by means of standard physical transmission line models. From measurements of several microstrip test structures the intrinsic microstrip line characteristics are extracted up to 110 GHz by applying de-embedding techniques. The de-embedded measurement results obtained are in a very good agreement with the results of the proposed model and 3D electromagnetic simulations.
  • Keywords
    circuit simulation; microstrip lines; substrates; 3D electromagnetic simulation; characteristic impedance; circuit simulation; complex propagation coefficient; curve fitting algorithm; de-embedded measurement; de-embedding technique; integrated millimeter wave circuit; microstrip lines; microstrip test structure; silicon substrates; strip width dependence; Circuit simulation; Electromagnetic measurements; Integrated circuit measurements; Microstrip; Millimeter wave integrated circuits; Millimeter wave propagation; Millimeter wave technology; Silicon; Strips; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2009. EuMC 2009. European
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-4748-0
  • Type

    conf

  • Filename
    5296258