Title :
Classification and 3D stack of Embedded Components technology in Substrate
Author :
Yang, Zhicheng ; Gunawan, Ferlee ; Gu, Xin ; Ding, Kunpeng ; He, Hao
Author_Institution :
Shennan Circuits Co., Ltd, Gao Qiao Industrial Park East, Long Gang District, Shenzhen 518117, China
Abstract :
Recently, Embedded Components in Substrates (ECiS) technology has been developed with many technologies. Some of these technologies are very mature and compatible for any conventional processes of PCB/Substrate manufacturing which need to be supported by SMT processes. Nowadays, some of electronic products with ECiS technologies already got high volume production scale. As frontline, this paper will describe about the classification of these ECiS technologies.
Keywords :
Fabrication; Reliability; Stacking; Substrates; 3D Stack technology; Advanced packaging technology; Embedded Components in Substrate; SiP;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236674
