Study on rework process of BGA components

With the development of high density integrated packaging technology, BGA component, because of its advantages, such as high integration, reliability, and low energy consumption, which has been widely used. In the field of R&D, the renewal speed of integrated circuit products is faster than before. Because of BGA component price is expensive that reduced the cost of replacement, even if the BGA component and secondary utilization is effective to repair. This article studied on the repair process of BGA component, shows that the BGA component dismantling and solder balls repairing firstly. Then adopting different diameter of solder ball and process of curving temperatures by the soldering strength test, which is to obtain the best process parameters for reworking process. Describes the BGA component repair installation and detection method, and analyzed and summarized its normal failure mechanism at last.