Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules

Author

Goossen, K.W.

Author_Institution

Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA

Volume

2

fYear

2004

fDate

7-11 Nov. 2004

Firstpage

653

Abstract

Utilization of optical links must fit current packaging scenarios in electrical systems. Due to interboard spacing in electrical system racks, optical interconnects must go though a right angle turn to reach the backplane which is commonly the case in the manufacture of VCSEL optoelectronic module. VCSEL reliability is also an issue in hampering its utilization. Increasing data rate in VCSEL entails increasing current density which reduces reliability. The talk offers a detailed discussion on the packaging, and reliability and failure of VCSELs.

Keywords

integrated circuit packaging; integrated optics; integrated optoelectronics; laser cavity resonators; optical backplanes; reliability; semiconductor device packaging; semiconductor laser arrays; surface emitting lasers; VCSEL optoelectronic module; arrayed optoelectronic modules; backplane; current density; electrical system racks; electrical world-packaging; interboard spacing; optical interconnects; optical links; reliability; Bandwidth; Bonding; Optical arrays; Optical fiber communication; Optical interconnections; Packaging; Stimulated emission; Surface fitting; Telecommunication network reliability; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE

Print_ISBN

0-7803-8557-8

Type

conf

DOI

10.1109/LEOS.2004.1363408

Filename

1363408