DocumentCode :
2021169
Title :
Failure modes in GZO FC-light-emitting diodes
Author :
Yang Bai ; Tingting Nan ; Jianhua Zhang ; Luqiao Yin
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Univ., Shanghai, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
765
Lastpage :
769
Abstract :
GaN-based light-emitting diodes (LEDs) with Ga-doped ZnO (GZO) as current spreading layer was fabricated and investigated. At 350mA injection current, the light output power of GZO LED degraded 6% after 554 h under stress of 85°c/85%RH. We could see the current crowding effect appeared in GZO LEDs. The junction temperature of GZO LEDs became higher could exacerbate the devices. It was also can be find that the mainly reason of decay in GZO LEDs was the Ag layer of GZO LEDs generated AgO in the aging process. Lots of AgO in Ag layers resulted in a decline of reflectance could reducing the optical power of the device, and it might weaken the reliability of the LED device.
Keywords :
II-VI semiconductors; III-V semiconductors; gallium; gallium compounds; light emitting diodes; reliability; wide band gap semiconductors; zinc compounds; AgO; GZO FC-light-emitting diodes; GaN; ZnO:Ga; aging process; current 350 mA; current crowding effect; current spreading layer; failure modes; injection current; junction temperature; light output power; reflectance; reliability; stress; Aging; Junctions; Light emitting diodes; Power generation; Reliability; Silicon compounds; Stress; AgO; GZO; LED; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha
Type :
conf
DOI :
10.1109/ICEPT.2015.7236695
Filename :
7236695
Link To Document :
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