• DocumentCode
    2021185
  • Title

    Development of structure function analysis system for power semiconductor devices

  • Author

    Que, Xiufu ; Liu, Yanan ; Yang, Lianqiao ; Chen, Wei ; Zhang, Jianhua

  • Author_Institution
    School of Mechatronic Engineering and Automation, Shanghai University, 200072, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    770
  • Lastpage
    774
  • Abstract
    In this paper, a structure function analysis system consist of two parts: lower machine and upper machine is developed. The lower machine provides the devices under test (DUT) a variable temperature environment and precise current in the test, in the meanwhile, the forward voltage is recorded. The upper machine is mainly used to transfer the test parameters to lower machine by Labview and process the data information send from lower machine by Matlab, which can further obtain the structure function of DUT. The developed structure function analysis system can test the K coefficient and cooling curve, and calculate the structure function, which shows detailed thermal resistance and thermal capacity information of DUT. It´s meaningful and promising to develop the structure function analysis system with low cost and high efficiency.
  • Keywords
    Cooling; Deconvolution; Electronic packaging thermal management; Heating; Temperature measurement; Thermal resistance; K coefficient; cooling curve; semiconductor; structure function; transient thermal test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236696
  • Filename
    7236696