DocumentCode :
2021185
Title :
Development of structure function analysis system for power semiconductor devices
Author :
Que, Xiufu ; Liu, Yanan ; Yang, Lianqiao ; Chen, Wei ; Zhang, Jianhua
Author_Institution :
School of Mechatronic Engineering and Automation, Shanghai University, 200072, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
770
Lastpage :
774
Abstract :
In this paper, a structure function analysis system consist of two parts: lower machine and upper machine is developed. The lower machine provides the devices under test (DUT) a variable temperature environment and precise current in the test, in the meanwhile, the forward voltage is recorded. The upper machine is mainly used to transfer the test parameters to lower machine by Labview and process the data information send from lower machine by Matlab, which can further obtain the structure function of DUT. The developed structure function analysis system can test the K coefficient and cooling curve, and calculate the structure function, which shows detailed thermal resistance and thermal capacity information of DUT. It´s meaningful and promising to develop the structure function analysis system with low cost and high efficiency.
Keywords :
Cooling; Deconvolution; Electronic packaging thermal management; Heating; Temperature measurement; Thermal resistance; K coefficient; cooling curve; semiconductor; structure function; transient thermal test;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
Type :
conf
DOI :
10.1109/ICEPT.2015.7236696
Filename :
7236696
Link To Document :
بازگشت