DocumentCode
2021185
Title
Development of structure function analysis system for power semiconductor devices
Author
Que, Xiufu ; Liu, Yanan ; Yang, Lianqiao ; Chen, Wei ; Zhang, Jianhua
Author_Institution
School of Mechatronic Engineering and Automation, Shanghai University, 200072, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
770
Lastpage
774
Abstract
In this paper, a structure function analysis system consist of two parts: lower machine and upper machine is developed. The lower machine provides the devices under test (DUT) a variable temperature environment and precise current in the test, in the meanwhile, the forward voltage is recorded. The upper machine is mainly used to transfer the test parameters to lower machine by Labview and process the data information send from lower machine by Matlab, which can further obtain the structure function of DUT. The developed structure function analysis system can test the K coefficient and cooling curve, and calculate the structure function, which shows detailed thermal resistance and thermal capacity information of DUT. It´s meaningful and promising to develop the structure function analysis system with low cost and high efficiency.
Keywords
Cooling; Deconvolution; Electronic packaging thermal management; Heating; Temperature measurement; Thermal resistance; K coefficient; cooling curve; semiconductor; structure function; transient thermal test;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236696
Filename
7236696
Link To Document