DocumentCode :
2021342
Title :
A high performance DC-20 GHz SPDT switch in a low cost plastic QFN package
Author :
Xiao, Qun ; Samiotes, George ; Galluccio, Thomas ; Rizzi, Brian
Author_Institution :
M/A-Com Technol. Solutions, Inc., Lowell, MA, USA
fYear :
2009
fDate :
Sept. 29 2009-Oct. 1 2009
Firstpage :
1673
Lastpage :
1676
Abstract :
This paper reviews the design and measurements of a DC-20 GHz GaAs SPDT (single-pole-double-throw) switch with state-of-the art insertion loss, isolation and power handling in a low cost plastic QFN (quad flatpack non-lead) package. To reduce the performance degradation introduced by the plastic QFN package, 3D EM (electromagnetic) modelling was used to characterize the interconnection between the MMIC die and the package. The packaged switch yields 1.7 dB maximum insertion loss and 40 dB minimum isolation from DC to 20 GHz. The comparison between this result and the data measured from the MMIC bare die shows no significant performance deterioration caused by the package. The switch utilizes M/A-COM´s 0.5 μm pHEMT (pseudomorphic high electron mobility transistor) process which is based on an AlGaAs/InGaAs/GaAs material system.
Keywords :
III-V semiconductors; aluminium compounds; field effect transistor switches; gallium arsenide; indium compounds; microwave switches; plastic packaging; power semiconductor switches; semiconductor device measurement; semiconductor device models; semiconductor device packaging; 3D EM modelling; AlGaAs-InGaAs-GaAs; GaAs; QFN package; SPDT switch; frequency 20 GHz; insertion loss; loss 1.7 dB; pseudomorphic high electron mobility transistor; quad flatpack nonlead package; single-pole-double-throw switch; Costs; Electromagnetic measurements; Gallium arsenide; Insertion loss; Loss measurement; MMICs; PHEMTs; Plastic packaging; Power measurement; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2009. EuMC 2009. European
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4748-0
Type :
conf
Filename :
5296295
Link To Document :
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