DocumentCode
2021462
Title
The realiazation of big networking dream from challenging electronic to interconnect technology (part 1)
Author
He, David ; Xiang, Yu ; Wang, Rocky ; Chung, DF ; Wang, Paul
Author_Institution
Technology Engineering and Global Quality, MiTAC International, Inc, Foshan, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
816
Lastpage
821
Abstract
This article is part 1 of a series of study on new generation of electronic challenging and interconnects process technology for networking computer products such as core router for service provider, edge and branch router for enterprise networking companies, and small switch and wireless router for commercial and SOHO (small and home office). All these networking products require high data speed in tera bits per second and high reliability for new generation of mobile user whenever and wherever they are. The super mobility and reliability performances are backbone for this big dream of networking.
Keywords
Market research; Reliability engineering; Switches; Wireless communication; 0201; IMC thermal mass depandency; Network; Networking product; Particulate control and management; VIP; VIPPO; interconnect relibaility; mobility; optical modul; pad pattern; surface finish; tombstone;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236706
Filename
7236706
Link To Document