• DocumentCode
    2021462
  • Title

    The realiazation of big networking dream from challenging electronic to interconnect technology (part 1)

  • Author

    He, David ; Xiang, Yu ; Wang, Rocky ; Chung, DF ; Wang, Paul

  • Author_Institution
    Technology Engineering and Global Quality, MiTAC International, Inc, Foshan, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    816
  • Lastpage
    821
  • Abstract
    This article is part 1 of a series of study on new generation of electronic challenging and interconnects process technology for networking computer products such as core router for service provider, edge and branch router for enterprise networking companies, and small switch and wireless router for commercial and SOHO (small and home office). All these networking products require high data speed in tera bits per second and high reliability for new generation of mobile user whenever and wherever they are. The super mobility and reliability performances are backbone for this big dream of networking.
  • Keywords
    Market research; Reliability engineering; Switches; Wireless communication; 0201; IMC thermal mass depandency; Network; Networking product; Particulate control and management; VIP; VIPPO; interconnect relibaility; mobility; optical modul; pad pattern; surface finish; tombstone;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236706
  • Filename
    7236706