DocumentCode :
2021462
Title :
The realiazation of big networking dream from challenging electronic to interconnect technology (part 1)
Author :
He, David ; Xiang, Yu ; Wang, Rocky ; Chung, DF ; Wang, Paul
Author_Institution :
Technology Engineering and Global Quality, MiTAC International, Inc, Foshan, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
816
Lastpage :
821
Abstract :
This article is part 1 of a series of study on new generation of electronic challenging and interconnects process technology for networking computer products such as core router for service provider, edge and branch router for enterprise networking companies, and small switch and wireless router for commercial and SOHO (small and home office). All these networking products require high data speed in tera bits per second and high reliability for new generation of mobile user whenever and wherever they are. The super mobility and reliability performances are backbone for this big dream of networking.
Keywords :
Market research; Reliability engineering; Switches; Wireless communication; 0201; IMC thermal mass depandency; Network; Networking product; Particulate control and management; VIP; VIPPO; interconnect relibaility; mobility; optical modul; pad pattern; surface finish; tombstone;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
Type :
conf
DOI :
10.1109/ICEPT.2015.7236706
Filename :
7236706
Link To Document :
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