• DocumentCode
    2021466
  • Title

    Computational studies of ICP thermal plasma torch: effects of the flow and wall cooling on temperature distribution

  • Author

    Kudriavtsev, V. ; Kolobov, V. ; Suh, K.W. ; An, Sanghyuk

  • Author_Institution
    CFD CANADA, Huntsville, AL, USA
  • fYear
    2003
  • fDate
    5-5 June 2003
  • Firstpage
    387
  • Abstract
    Summary form only given, as follows. In this work we simulate in 2D argon and oxygen plasma torches using the approximation of thermal equilibrium. Computational model includes Maxwell equation for power deposition Navier-Stokes and Gas flow energy equations with variable thermodynamic and electric properties. Gas density is calculated out of ideal gas law. We compared results obtained with and without body forces accounting for various orientations of plasma torches (up and down). We found that temperature distribution can be significantly altered and influenced by the flow inlet location, mass flow rate and torch orientation with respect to gravity force. We also found that at certain flow conditions radial temperature peak can move close to the skin layer. Computational model was compared and validated against existing experimental data.
  • Keywords
    Maxwell equations; Navier-Stokes equations; argon; oxygen; plasma materials processing; plasma simulation; plasma temperature; plasma torches; temperature distribution; 2D torches; Ar; CFD-PLASMA computer code; ICP thermal plasma torch; Maxwell equation; Navier-Stokes equations; O; body forces; boundary conditions; computational model; flow swirl; gas flow energy equations; gas/wall radiation; plasma temperature; power deposition; skin layer; temperature distribution; thermal equilibrium; torch orientation; Argon; Computational modeling; Cooling; Distributed computing; Maxwell equations; Plasma density; Plasma properties; Plasma simulation; Plasma temperature; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
  • Conference_Location
    Jeju, South Korea
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-7911-X
  • Type

    conf

  • DOI
    10.1109/PLASMA.2003.1229030
  • Filename
    1229030