Title :
Reliability of graphene-based films used for high power electronics packaging
Author :
Huang, Shirong ; Zhang, Yong ; Wang, Nan ; Wang, Ning ; Fu, Yifeng ; Ye, Lilei ; Liu, Johan
Author_Institution :
SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, Box 282, Yanchang Road 149, 200072, China
Abstract :
Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer´s method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
Keywords :
Films; Heating; Packaging; Reliability; Substrates; Thermal management; Thermal resistance; electronic packaging; graphene-based film; reliability test;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236714
