Substrate design of a 3-D microwave front-end multi-chip module with antennas integrated

This paper demonstrates the substrate design considerations of a 3-dimensional (3-D) microwave (MW) multi-chip module (MCM). This module is a dual-band microwave front-end working at Ka-band (Transmit) and K-band (Receive). Three organic substrates are stacked up via ball grid array (BGA), combining a transceiver module with both frequency band antennas integrated. Substrate design needs considerations of multiple aspects. As for active chips, selection and placement of MMICs, bond wire design, Electromagnetic (EM) isolation and thermal management of high power MMICs are of great importance. As for passive components patterned on the substrates, band pass filter, DC-AC block and antennas are main devices need to be simulated and optimized.