Title :
Degradation mechanisms of solder joints on printed circuit boards during storage determined by infrared multi-point temperature measurements
Author :
Kong, Lingchao ; Zheng, Zhen ; An, Rong ; Li, Hailong ; Fu, Mingliang ; Tian, Yanhong ; Wang, Chunqing ; An, Rong ; Wang, Chunqing
Author_Institution :
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China
Abstract :
In this study, microstructure evolution at intermetallic interfaces in solder joints on printed circuit boards during storage was investigated at various aging temperatures, and compared with the nondestructive infrared temperature measurements and electrical resistance measurements. Results show that the defects and microstructure evolution of solder joints were identified effectively via infrared multi-point temperature measurements. However, electrical properties have no obvious change in the solder joints.
Keywords :
Gold; Reliability; Temperature measurement; accelerated storage; degradation mechanism; infrared measurements; solder joints;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236727
