• DocumentCode
    2022197
  • Title

    System integration of a SERF atomic magnetometer on a glass wafer substrate

  • Author

    Ji, Yu ; Shang, Jintang ; Gan, Qi ; Wu, Lei

  • Author_Institution
    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    939
  • Lastpage
    942
  • Abstract
    High sensitive SERF(spin-exchange-relaxation-free) atomic magnetometers play an important role in many fields including geophysical mapping, space science, nuclear magnetic resonance, health care and perimeter and remote monitoring. This paper presents a novel approach for the system integration of a SERF atomic magnetometer. First of all, Rb vapor cell integrated with micro heater and Helmholtz coils was selected as physic part of the system and the vapor cell was characterized by pressure broadening effect to analyze nitrogen buffer gas pressure in the vapor cell. Then optical module including laser, micro-lens to collimate light beam emitting from the laser, quarter-wave plate to circularly polarize laser beam was taken as optical pumping and probing source simultaneously, and the interaction of circularly polarized laser beam with rubidium atoms was detected by silicon PIN photo-detectors. At last, Laser module, physics part of the system and silicon PIN photo-detector were integrated on a glass wafer substrate benefiting from the characteristics of non-magnetic material and good flatness, based on the integrated SERF atomic magnetometer, weak magnetic field could be measured. Results demonstrate that the SERF atomic magnetometer is integrated successfully and could be used for the detection of weak magnetic field.
  • Keywords
    Atom optics; Atomic measurements; Magnetic field measurement; Magnetometers; Optical device fabrication; Optical polarization; Optical pumping; Rb vapor cell; SERF atomic magnetometer; glass wafer substrate; system integration; weak magnetic field;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236733
  • Filename
    7236733