Title :
An overview of microwave component requirements for future space applications
Author :
Barnes, A.R. ; Boetti, A. ; Marchand, L. ; Hopkins, J.
Author_Institution :
Dept. of Product Assurance & Safety, Eur. Space Agency, Noordwijk, Netherlands
Abstract :
New and emerging microwave component developments and their potential impact upon payload implementation for future European Space Agency (ESA) missions are discussed. Consideration is given to the use of indium antimonide (InSb), gallium nitride (GaN), RF CMOS along with MEMS and advanced packaging techniques.
Keywords :
CMOS integrated circuits; III-V semiconductors; gallium compounds; indium compounds; microwave devices; packaging; radiofrequency integrated circuits; satellite communication; wide band gap semiconductors; ESA missions; European Space Agency missions; GaN; InSb; MEMS; RF CMOS; advanced packaging techniques; gallium nitride; indium antimonide; microwave component requirements; space applications; Artificial satellites; Downlink; Frequency; Gallium nitride; Geoscience; Payloads; Satellite broadcasting; Space missions; Space technology; Transponders;
Conference_Titel :
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location :
Paris
Print_ISBN :
88-902012-0-7
