Title :
A method for the radiated emission test of IC modules
Author :
Lingling, Yang ; Haiyan, Sun ; Ling, Sun ; Shenlong, Wang ; Boyuan, Zhu ; Junwei, Lu
Author_Institution :
Xinlin College, Nantong University, China
Abstract :
A test method for evaluating the radiated emission of IC modules is presented in this paper and a radiated emission test platform based on TEM cell is built. The whole test process includes the verification of test platform and the designed testing PCB, the MCU radiated emission testing under the different working conditions. Thus, the method introduced in this paper is helpful to make a reasonable choice of the suitable MCU module for system application.
Keywords :
Electromagnetic compatibility; Electronics packaging; Frequency measurement; IEC Standards; Integrated circuits; TEM cells; Transmission line measurements; QFP package; TEM cell; radiated emission;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236741
