Title :
Effects of heatsink on the performance of high power semiconductor lasers
Author :
Liming He ; Chuzhong Zhao ; Wenbin Liu ; Shujuan Wu ; Bocang Qiu ; Hu, Martin ; Yan Liu
Author_Institution :
Shenzhen Raybow Optoelectron. Corp, Shenzhen, China
Abstract :
we report on our investigation of the impacts of different thermal configurations of chip-on-submounts (COS) on the performance of high power semiconductor lasers. Two types of submounts are studied; one is AlN sub-mount, and the other is AlN submount with both top and bottom surfaces being coated with thick copper layers. Both theoretical analysis and experiments are performed. Our results show COS with AlN submount coated with thick copper layers has improved thermal and laser performance.
Keywords :
III-V semiconductors; aluminium compounds; heat sinks; semiconductor lasers; thermal management (packaging); AlN; AlN submount; COS; Cu; chip-on-submounts; heatsink; high-power semiconductor lasers; thermal configurations; thick copper layers; Aluminum nitride; Copper; Electronic packaging thermal management; Heating; III-V semiconductor materials; Temperature measurement; Thermal resistance; FEA; High power diode laser; Thermal management; heatsink;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha
DOI :
10.1109/ICEPT.2015.7236747
