• DocumentCode
    2022660
  • Title

    Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint

  • Author

    Peng, Hao ; Huang, Bomin ; Chen, Guang ; Wu, Fengshun ; Liu, Hui ; Chan, YC

  • Author_Institution
    College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    1014
  • Lastpage
    1017
  • Abstract
    In this study, 0.8 wt% Al2O3 nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3 nanoparticles addition, finer microstructure with smaller ß-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of Al2O3 nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.
  • Keywords
    Copper; Lead; Reliability; Al2O3 nanoparticles; IMC; composite solder; electromigration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236751
  • Filename
    7236751
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2022660