DocumentCode
2022955
Title
Experimental study of chip offset on the packaging consistency of high power light-emitting diodes
Author
Xie, Bin ; Chen, Qi ; Yu, Xingjian ; Shang, Bofeng ; Huang, Mengyu ; Luo, Xiaobing
Author_Institution
School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
1062
Lastpage
1065
Abstract
In this study, we experimentally investigated the effect of chip offset on the packaging consistency of high power LED. A series of LED modules with different chip offset distances and phosphor mass concentration were packaged, and two comparative experiments were conducted. Compared with the conventional modules, the maximum CCT deviation of off-centered modules increased from 128K to 667K. The results show that chip offset contributes significantly to the consistency of LED packaging.
Keywords
Coatings; Color; Lead; Light emitting diodes; Lighting; Packaging; Phosphors; chip offset; correlated color temperature; light-emitting diodes; packaging consistency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236763
Filename
7236763
Link To Document