• DocumentCode
    2022976
  • Title

    Simulation of stamp-printed coating process in light-emitting diodes packaging by Lattice Boltzmann method

  • Author

    Mengyu Huang ; Lan Li ; Chao Yuan ; Bin Xie ; Xingjian Yu ; Xiaobing Luo

  • Author_Institution
    Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    1066
  • Lastpage
    1069
  • Abstract
    To get white light emission, it´s usual to use a blue LED chip covered with yellow emitting phosphor via a dispensing process. Stamp printing is such a process of free-surface flow, which decides the morphology of the phosphor gel, and thus has a great effect on the optical performance of LEDs. Therefore, it is important to study the phosphor gel flow in the stamp-printed coating process. In this paper, a flow model was established to simulate the coating process based on the two-dimensional Lattice Boltzmann method (LBM). With the model, dynamic morphology of phosphor gel was obtained. Two factors, the ratio of LED chip width to the width of stamp bump and phosphor gel volume, were investigated through simulations. In addition, complex phosphor layer morphology was achieved by adapting the two factors.
  • Keywords
    coating techniques; gels; lattice Boltzmann methods; light emitting diodes; packaging; phosphors; LED chip width; Lattice Boltzmann method; blue LED chip; dynamic morphology; light-emitting diodes packaging; phosphor gel flow; stamp bump width; stamp-printed coating; white light emission; Coatings; Lattices; Light emitting diodes; Numerical models; Photonics; Surface morphology; Lattice Boltzmann method; numerical simulation; stamp-printed coating process; two phase flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236764
  • Filename
    7236764