DocumentCode
2022976
Title
Simulation of stamp-printed coating process in light-emitting diodes packaging by Lattice Boltzmann method
Author
Mengyu Huang ; Lan Li ; Chao Yuan ; Bin Xie ; Xingjian Yu ; Xiaobing Luo
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
1066
Lastpage
1069
Abstract
To get white light emission, it´s usual to use a blue LED chip covered with yellow emitting phosphor via a dispensing process. Stamp printing is such a process of free-surface flow, which decides the morphology of the phosphor gel, and thus has a great effect on the optical performance of LEDs. Therefore, it is important to study the phosphor gel flow in the stamp-printed coating process. In this paper, a flow model was established to simulate the coating process based on the two-dimensional Lattice Boltzmann method (LBM). With the model, dynamic morphology of phosphor gel was obtained. Two factors, the ratio of LED chip width to the width of stamp bump and phosphor gel volume, were investigated through simulations. In addition, complex phosphor layer morphology was achieved by adapting the two factors.
Keywords
coating techniques; gels; lattice Boltzmann methods; light emitting diodes; packaging; phosphors; LED chip width; Lattice Boltzmann method; blue LED chip; dynamic morphology; light-emitting diodes packaging; phosphor gel flow; stamp bump width; stamp-printed coating; white light emission; Coatings; Lattices; Light emitting diodes; Numerical models; Photonics; Surface morphology; Lattice Boltzmann method; numerical simulation; stamp-printed coating process; two phase flow;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha
Type
conf
DOI
10.1109/ICEPT.2015.7236764
Filename
7236764
Link To Document