DocumentCode
2022983
Title
A process variation aware system-level framework to model on-chip communication system in support of fault tolerant analysis
Author
Forooshani, Arash Abtahi ; Rokhani, Fakhrul Zaman ; Samsudin, Khairulmizam ; Aziz, Samsuzana Abd
Author_Institution
Dept. of Comput. & Commun. Syst., Univ. Putra Malaysia, Serdang, Malaysia
fYear
2009
fDate
16-18 Nov. 2009
Firstpage
97
Lastpage
100
Abstract
On-chip interconnect communication system consists of the drivers, interconnect wires and receivers. Several on-chip communication system models have been developed for the purpose of on-chip fault-tolerant communication research. While most of these models improved the channel modeling, the effects of the drivers and receivers to the whole communication system were largely ignored. In this paper, we introduce a comprehensive, system-level framework, to capture and integrate the characteristics of the channel as well as the drivers and receivers. The proposed framework offers a methodology to model the on-chip interconnect communication system and can provide a flexible and updateable platform to evaluate fault-tolerant communication approaches. Furthermore, the current deterministic paradigm which end is worst case analysis pessimism is avoided by shifting towards statistical design flow to reduce uncertainties caused by process variation.
Keywords
fault tolerance; integrated circuit interconnections; statistical analysis; system-on-chip; channel modeling; fault tolerant analysis; interconnect wires; onchip interconnect communication system; process variation aware system-level framework; uncertainties; Bit error rate; Design engineering; Fault tolerance; Fault tolerant systems; Integrated circuit interconnections; Power system modeling; Semiconductor device noise; System-on-a-chip; Timing; Uncertainty; Deep Submicron (DSM); Fault Tolerant Analysis; On-chip Communication; Process Variation; System-level Modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Research and Development (SCOReD), 2009 IEEE Student Conference on
Conference_Location
UPM Serdang
Print_ISBN
978-1-4244-5186-9
Electronic_ISBN
978-1-4244-5187-6
Type
conf
DOI
10.1109/SCORED.2009.5443278
Filename
5443278
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