• DocumentCode
    2022983
  • Title

    A process variation aware system-level framework to model on-chip communication system in support of fault tolerant analysis

  • Author

    Forooshani, Arash Abtahi ; Rokhani, Fakhrul Zaman ; Samsudin, Khairulmizam ; Aziz, Samsuzana Abd

  • Author_Institution
    Dept. of Comput. & Commun. Syst., Univ. Putra Malaysia, Serdang, Malaysia
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    97
  • Lastpage
    100
  • Abstract
    On-chip interconnect communication system consists of the drivers, interconnect wires and receivers. Several on-chip communication system models have been developed for the purpose of on-chip fault-tolerant communication research. While most of these models improved the channel modeling, the effects of the drivers and receivers to the whole communication system were largely ignored. In this paper, we introduce a comprehensive, system-level framework, to capture and integrate the characteristics of the channel as well as the drivers and receivers. The proposed framework offers a methodology to model the on-chip interconnect communication system and can provide a flexible and updateable platform to evaluate fault-tolerant communication approaches. Furthermore, the current deterministic paradigm which end is worst case analysis pessimism is avoided by shifting towards statistical design flow to reduce uncertainties caused by process variation.
  • Keywords
    fault tolerance; integrated circuit interconnections; statistical analysis; system-on-chip; channel modeling; fault tolerant analysis; interconnect wires; onchip interconnect communication system; process variation aware system-level framework; uncertainties; Bit error rate; Design engineering; Fault tolerance; Fault tolerant systems; Integrated circuit interconnections; Power system modeling; Semiconductor device noise; System-on-a-chip; Timing; Uncertainty; Deep Submicron (DSM); Fault Tolerant Analysis; On-chip Communication; Process Variation; System-level Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Research and Development (SCOReD), 2009 IEEE Student Conference on
  • Conference_Location
    UPM Serdang
  • Print_ISBN
    978-1-4244-5186-9
  • Electronic_ISBN
    978-1-4244-5187-6
  • Type

    conf

  • DOI
    10.1109/SCORED.2009.5443278
  • Filename
    5443278