• DocumentCode
    2023036
  • Title

    A rigorous full-wave analysis of electrical interconnects for VLSI packages

  • Author

    Gedney, Stephen D.

  • Author_Institution
    Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    73
  • Lastpage
    75
  • Abstract
    A rigorous analysis of electrical interconnects of VLSI packages using the planar generalized Yee-algorithm is presented. The highly efficient algorithm is based on the discretization of the time-dependent Maxwell´s equations using unstructured grids, and is demonstrated as being capable of accurately modeling large interconnect networks with complex geometries
  • Keywords
    VLSI; VLSI packages; discretization; electrical interconnects; full-wave analysis; interconnect networks; planar generalized Yee-algorithm; time-dependent Maxwell equations; Finite difference methods; Integrated circuit interconnections; Magnetic analysis; Packaging; Predictive models; Pulsed power supplies; Sparse matrices; Time domain analysis; Transmission lines; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594086
  • Filename
    594086
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2023036