Title :
A rigorous full-wave analysis of electrical interconnects for VLSI packages
Author :
Gedney, Stephen D.
Author_Institution :
Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
Abstract :
A rigorous analysis of electrical interconnects of VLSI packages using the planar generalized Yee-algorithm is presented. The highly efficient algorithm is based on the discretization of the time-dependent Maxwell´s equations using unstructured grids, and is demonstrated as being capable of accurately modeling large interconnect networks with complex geometries
Keywords :
VLSI; VLSI packages; discretization; electrical interconnects; full-wave analysis; interconnect networks; planar generalized Yee-algorithm; time-dependent Maxwell equations; Finite difference methods; Integrated circuit interconnections; Magnetic analysis; Packaging; Predictive models; Pulsed power supplies; Sparse matrices; Time domain analysis; Transmission lines; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594086
