DocumentCode
2023132
Title
Thermal modeling and optimization for electronic packages
Author
Wang, Zhifeng ; Sun, Haiyan ; Sun, Ling ; Wang, Xuemin ; Yang, Lingling
Author_Institution
Jiangsu Key Laboratory of ASIC Design, Nantong University, No.9 Seyuan road, 226019, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
1086
Lastpage
1089
Abstract
QFP (Quad Flat Package) has been widely used in modern electronic packages and its reliability has been paid a lot of attention. A general thermal resistance network of QFP is presented in this paper and the total thermal resistance has been estimated. A 3D model of the QFP-48 has been established and the thermal simulation has been done in ANSYS software. The equivalent total thermal resistance has been calculated according to the simulated results and compared with the estimated value at the same time. Some methods about thermal optimization for QFP package have been put forward and verified. The conclusions presented here are expected to provide the thermal design guidelines for QFP package.
Keywords
Conductivity; Electronics packaging; Plastics; Resistance heating; Thermal conductivity; Thermal resistance; QFP; thermal resistance; thermal simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236769
Filename
7236769
Link To Document