DocumentCode :
2023213
Title :
RF characteristics of BJT devices with selectively or fully ion-implanted collector
Author :
Meng, C.C. ; Su, J.Y. ; Tsou, B.C. ; Huang, G.W.
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2005
fDate :
3-4 Oct. 2005
Firstpage :
161
Lastpage :
164
Abstract :
A selectively ion-implanted collector (SIC) is implemented in a 0.8 /spl mu/m BiCMOS process to improve the RF characteristics of the BJT devices. The SIC BJT device has better ft and fmax than the FIC (fully ion-implanted collector) BJT device because the extrinsic base-collector capacitance is reduced by the SIC process. The fmax is 9.5 GHz and ft is 7.8 GHz for the SIC BJT device while the fmax is 7.2 GHz and fmax is 4.5 GHz for the FIC BJT device when biased at Vce=3.6 V and Jc=0.09 mA//spl mu/m/sup 2/. The noise parameters are the same for both BJT devices but the associated gain is higher for the SIC BJT device.
Keywords :
BiCMOS integrated circuits; microwave bipolar transistors; 0.8 mum; 3.6 V; 4.5 GHz; 7.2 GHz; 7.8 GHz; 9.5 GHz; BJT devices; BiCMOS process; RF characteristics; extrinsic base-collector capacitance; fully ion-implanted collector; noise parameters; selectively ion-implanted collector; BiCMOS integrated circuits; Bipolar transistor circuits; Capacitance; Capacitors; Circuit noise; Fingers; Ion implantation; Laboratories; Radio frequency; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location :
Paris
Print_ISBN :
88-902012-0-7
Type :
conf
Filename :
1637175
Link To Document :
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