Title :
Reliability analysis of and experiment test on SAC305 solder balls
Author :
Tian, Wenchao ; Wei, Sanjuan
Author_Institution :
School of Electro-Mechanical Engineering, Xidian University, Xi´an, 710071, China
Abstract :
The thermal cycle analysis of the module on the basis of physical electronic packaging is researched in this paper, and the stress-strain hysteresis curve and the life of dangerous SAC305 lead-free solder balls are analyzed as the screw positions change. The related experiment is performed, and the results show that when the screw position is near to the chip, the life of SAC305 is longer, while it is farther, the life is shorter, which are in good agreement with the simulation results.
Keywords :
Fasteners; Lead; Packaging; Reliability; Temperature measurement; Upper bound; Voltage measurement; SAC305; reliability life; screw preloaded locations; thermal cycle;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236780
