Time domain interconnect model generation of Alloy-42 lead frames

Quad Flat Packages (QFPs) using ceramic bases and lids (CQFP) are very popular for packaging high-power devices that cannot be packaged in inexpensive encapsulated Plastic QFPs. The package lead frame must be made of Alloy 42 to be TCE compatible with the ceramic. Models of Alloy-42 interconnect circuits should take into account all the frequency dependent properties in a time domain simulation. In this paper a three ladder RL interconnect model is used to optimize around a scattering parameters file of CQFP measured data. Optimization is then performed in the frequency domain until the interconnect model is optimized to the measured data