Title :
Fabrication of a novel cantilever-based device by release the stress in a reliable way
Author :
Wang, Shuaipeng ; Yang, Jinling ; Chen, Yanning ; Zhang, Haifeng ; Zhao, Dongyan
Author_Institution :
NaRi Smartchip Microelectronics technology company limited, No.15 Xiaoying Rd(E), Qinghe, Beijing, China
Abstract :
Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was micro-fabricated for precise bio-marker detection.
Keywords :
Biomedical optical imaging; Biosensors; Optical device fabrication; Optical sensors; Packaging; MEMS; SOI precess; bio-sensor; cantilever; reliable;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236786
