DocumentCode
2023592
Title
Fabrication of a novel cantilever-based device by release the stress in a reliable way
Author
Wang, Shuaipeng ; Yang, Jinling ; Chen, Yanning ; Zhang, Haifeng ; Zhao, Dongyan
Author_Institution
NaRi Smartchip Microelectronics technology company limited, No.15 Xiaoying Rd(E), Qinghe, Beijing, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
1162
Lastpage
1164
Abstract
Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was micro-fabricated for precise bio-marker detection.
Keywords
Biomedical optical imaging; Biosensors; Optical device fabrication; Optical sensors; Packaging; MEMS; SOI precess; bio-sensor; cantilever; reliable;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236786
Filename
7236786
Link To Document