The optimization of process parameters based on the orthogonal experiments in wire bonding

Regarding the effects caused by power and time of 7476D semi-automatic bonding wire on surface of ceramic substrate wedge bonding wire performances. Orthogonal experiment named L9(34) had been designed using bonding power and bonding time to get results of pull test as the test index. After processing and analysis of test data using Statistical Package for Social Science 16.0 (SPSS16.0) software, influence degree of different factors is obtained, and the optimal technological conditions of bonding wire is obtained too, which can be further provided for the problems, causes and quality assessment of wire bonding analysis´ data support. From the analysis results, influence degree of different factors is obtained, and the optimum formula for bonding wire is obtained too. Bonding output power of the first bond is the key factor that affects the results of pull test. The optimal technological conditions are obtained as follows: The influence degree of each factor is not the same: A>D>B>C; the output power of the first bond is 0.32 watt; the output power of the first bond is 0.44 watt; bonding time of the first is bond 70 millisecond; bonding time of the second bond is 100 millisecond. Development of this work is of benefit to raising quality of gold wire wedge bonding. Through the above analysis, aiming at the problem of multiple factors and multiple levels, we can use the method of orthogonal test to solve test index, so not only reduced the number of test, and obtained the optimum formula.