• DocumentCode
    2023935
  • Title

    Investigation of dust in electrohydrodynamic (EHD) systems

  • Author

    Jewell-Larsen, N.E. ; Karpov, S.V. ; Ran, H. ; Savalia, P. ; Honer, K.A.

  • Author_Institution
    Tessera, San Jose, CA, USA
  • fYear
    2010
  • fDate
    21-25 Feb. 2010
  • Firstpage
    249
  • Lastpage
    255
  • Abstract
    Convection remains the most popular cooling solution for portable consumer electronic devices. However, increasing heat generation in microelectronics and the demand for increasingly compact devices has resulted in heat fluxes that are pushing the limit of conventional rotary fan air cooling technology. Electrohydrodynamic (EHD) ionic wind pumps offer a possible solution. In this technique, applying a voltage to a sharp electrode ionizes air molecules, which are propelled by the electric field, transferring momentum to neutral air molecules, thus creating airflow and cooling. A previous paper discussed the successful integration of an EHD cooling system in a notebook computer. It demonstrated the benefits of EHD cooling technology including silence, high coefficient of performance and flexible form factor, and discussed key technical challenges for commercialization. In this paper, we focus on a concern shared by both fan and EHD cooling systems: the accumulation of dust particles, which can result in performance loss. The fundamental mechanisms of particle collection within an EHD system are discussed, and a numerical model for predicting dust deposition is presented and verified using experimental results.
  • Keywords
    convection; cooling; dust; electrohydrodynamics; convection; dust investigation; dust particles; electrohydrodynamic systems; ionic wind pumps; microelectronics; neutral air molecules; numerical model; particle collection; portable consumer electronic devices; rotary fan air cooling; Commercialization; Consumer electronics; Electrodes; Electrohydrodynamics; Electronics cooling; Microelectronics; Numerical models; Performance loss; Propulsion; Voltage; Cooling; electrohydrodynamics; electronics; heat transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-9458-3
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2010.5444283
  • Filename
    5444283